7月1日,据《日经亚洲》(Nikkei Asia)报道,中国台湾第2大晶圆代工厂商联电(UMC)正在评估进军先进制程制造的可行性,目前这个领域主要由台积电、三星和英特尔主导。报道援引4名知情人士透露称,联电正探索未来的成长动能,可能包括6nm制程晶圆制造。目前6nm制程主要被用于制造智能电视和汽车的核心处理器,以及先进的Wi-Fi、射频(RF)和蓝牙等连接芯片,也有被应用于多种场景的人工智能(AI...
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