电子发烧友网综合报道近日,日月光半导体于2025年6月9日获得的增大电子元件与可挠性基板摩擦力的封装结构专利(授权公告号CN222953077U),是其在柔性电子封装领域的重要技术突破。在传统封装中,刚性基板与柔性连接件的界面易因应力集中产生微裂纹,导致器件失效。通过可挠性梯度设计,将应力分散至柔性层,连接处破裂概率下降50%以上,适用于高精度封装,减少制造过程中的损耗。在动态应力仿真中,该...
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