联电先进封装,拿下大客户

半导体行业观察
Jul 07, 2025

公众号记得加星标⭐️,第一时间看推送不会错过。来源:内容来自经济日报。联电跨足先进封装大跃进,夺下高通大单,自行开发的高阶中介层(Interposer)也获得高通验证,迈入量产出货倒数计时阶段。法人看好,联电透过跨国合作,携手国际大厂抢食AI等高速运算大商机,后市看俏,并可借由差异化优势,降低红色供应链在成熟制程晶圆代工市场激烈竞争的干扰。联电不评论特定客户,强调先进封装是该公司积极发展的重点,将...

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