7月7日消息,据台媒《经济日报》报道,晶圆代工大厂近期在晶圆代工市场积极进军高压制程技术平台,并传出将与英特尔在12nm制程上的合作延伸至6nm的同时,还传出已拿下高通先进封装大单的消息。报道称,联电2024年斥资新台币156亿元投入研发,专注开发5G通信、AI、物联网及车用电子等领域所需的制程技术,并钻研特殊制程,在12nm和14nm特殊制程及3D IC先进封装研发也有进展。目前联电正积极推进...
Source Link7月7日消息,据台媒《经济日报》报道,晶圆代工大厂近期在晶圆代工市场积极进军高压制程技术平台,并传出将与英特尔在12nm制程上的合作延伸至6nm的同时,还传出已拿下高通先进封装大单的消息。报道称,联电2024年斥资新台币156亿元投入研发,专注开发5G通信、AI、物联网及车用电子等领域所需的制程技术,并钻研特殊制程,在12nm和14nm特殊制程及3D IC先进封装研发也有进展。目前联电正积极推进...
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