消息称联电先进封装中介层获得高通验证,接近量产出货

IT之家
08 Jul

IT之家 7 月 8 日消息,台媒《经济日报》昨日报道称,联华电子(IT之家注:即联电、UMC)的先进封装中介层 (Interposer) 获得高通验证,进入试产阶段,有望 2026 年首季度量产出货。▲ 联电官网对中介层介绍报道指出,联电的先进封装中介层业务此前局限在 RFSOI 制程应用领域,对营收贡献有限;而与高通的合作则将业务扩展到高速计算芯片方面,包括 AI PC、车载芯片和 AI ...

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