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IT之家 7 月 7 日消息，比利时校际微电子研究中心 imec 与日本半导体设备龙头企业 TEL 当地时间 6 月 16 日宣布深化双方战略合作伙伴关系，启动新一期五年联合研发联盟。

imec 与 TEL 的合作已有 30 年历史，覆盖光刻、逻辑、存储和 3D 集成等关键领域，在 High NA EUV 光刻、蚀刻、湿法加工和沉积等方面取得了重大突破，双方联合研发的 EUV 光刻胶涂层轨道技术显著优化了缺陷率，在 EUV 技术生产导入中发挥了重要作用。

而双方新一阶段的合作将聚焦先进半导体在 2nm 名义节点后的进一步尺寸微缩，目标通过材料系统的优化和缺陷率的改进提升性能，为下一代 CFET 结构半导体提供先进沉积与蚀刻解决方案。此外两方还将继续一道探索未来半导体工艺的可持续发展。

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