WoW堆叠--引爆“终端AI”的突破性技术

华尔街见闻
18 Jul

当AI模型从云端“下沉”到手机、手表、眼镜等终端设备,本地运行变得越来越常见。这背后,离不开一项关键技术的突破——WoW堆叠(Wafer-on-Wafer)技术。 据追风交易台,摩根士丹利最新研报深度解析了WoW(晶圆堆叠)技术对边缘AI设备的革命性影响,它采用了3D封装解决方案,让芯片“上下叠加”,使终端设备也能拥有足够的算力和带宽,运行轻量AI模型,真正实现“随时、随地、即用”的AI体验。 ...

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