摩根大通发表研究报告指，ASMPT次季盈利略逊于预期，但由于持续的先进封装动能和中国主流半导体有所改善，第三季指引和订单表现略优于预期。摩通指出，ASMPT整体先进封装收入持续上升，达到今年上半年收入的39%，并预计在未来两年内升至约50%。然而，由于类比半导体的指引平淡以及中国消费性半导体在下半年补贴驱动的强劲表现后出现放缓，因此主流半导体的复苏持续性仍然存疑。该行考虑到尽管公司TCB和先进封装的比例上升，但毛利率仍然平稳，且经营开支维持在高位，营运杠杆或需时显现。该行将公司目标价由58港元上调至67港元，维持“中性”评级。
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