快科技7月23日消息,据媒体报道,全球光刻巨头尼康近日宣布,正式推出全球首款专为半导体后道工艺设计的无掩模光刻系统——DSP-100,并已启动全球预订,预计于2026年3月31日前正式上市。该设备以“高精度、大尺寸、高效率”为核心优势,旨在为快速发展的扇出型面板级封装(FOPLP)技术提供关键设备支持。DSP-100将FPD曝光设备的多镜组技术,与半导体高分辨率工艺相结合,实现了1.0μm(...
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