Worst Is Likely Over for ASMPT -- Market Talk

Dow Jones

Jul 24

0451 GMT - The worst is likely over for ASMPT, Citi analysts say in a research note. The semiconductor company has delivered a large thermocompression-bonding tool order to a leading memory chip maker, they say, while another client has begun using ASMPT's bonding tool for low-volume production of 12-layer HBM4 chips. Order volume could become more meaningful in 2026 and 2027 as next-generation AI chips ramp up, they say. Mainstream semiconductor outlook is also improving, driven by AI data centers and EV demand in China, the analysts say. Citi says that new orders for ASMPT's thermocompression-bonding tool could be positive catalysts for its share price. Citi maintains a buy call on ASMPT and raises its target price to HK$75.00 from HK$65.00. Shares are last at HK$69.00. (sherry.qin@wsj.com)

(END) Dow Jones Newswires

July 24, 2025 00:51 ET (04:51 GMT)

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The semiconductor company has delivered a large thermocompression-bonding tool order to a leading memory chip maker, they say, while another client has begun using ASMPT's bonding tool for low-volume production of 12-layer HBM4 chips. Order volume could become more meaningful in 2026 and 2027 as next-generation AI chips ramp up, they say. Mainstream semiconductor outlook is also improving, driven by AI data centers and EV demand in China, the analysts say. Citi says that new orders for ASMPT's thermocompression-bonding tool could be positive catalysts for its share price. Citi maintains a buy call on ASMPT and raises its target price to HK$75.00 from HK$65.00. Shares are last at HK$69.00. (sherry.qin@wsj.com) \n</p>\n<pre>\n \n</pre>\n<p>\n  (END) Dow Jones Newswires\n</p>\n<p>\n  July 24, 2025 00:51 ET (04:51 GMT)\n</p>\n<p>\n  Copyright (c) 2025 Dow Jones &amp; Company, Inc.\n</p>\n</font>","source":null,"html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>Worst Is Likely Over for ASMPT -- Market Talk</title>\n<style type=\"text/css\">\na,abbr,acronym,address,applet,article,aside,audio,b,big,blockquote,body,canvas,caption,center,cite,code,dd,del,details,dfn,div,dl,dt,\nem,embed,fieldset,figcaption,figure,footer,form,h1,h2,h3,h4,h5,h6,header,hgroup,html,i,iframe,img,ins,kbd,label,legend,li,mark,menu,nav,\nobject,ol,output,p,pre,q,ruby,s,samp,section,small,span,strike,strong,sub,summary,sup,table,tbody,td,tfoot,th,thead,time,tr,tt,u,ul,var,video{ font:inherit;margin:0;padding:0;vertical-align:baseline;border:0 }\nbody{ font-size:16px; line-height:1.5; color:#999; background:transparent; }\n.wrapper{ overflow:hidden;word-break:break-all;padding:10px; }\nh1,h2{ font-weight:normal; line-height:1.35; margin-bottom:.6em; }\nh3,h4,h5,h6{ line-height:1.35; margin-bottom:1em; }\nh1{ font-size:24px; }\nh2{ font-size:20px; }\nh3{ font-size:18px; }\nh4{ font-size:16px; }\nh5{ font-size:14px; }\nh6{ font-size:12px; }\np,ul,ol,blockquote,dl,table{ margin:1.2em 0; }\nul,ol{ margin-left:2em; }\nul{ list-style:disc; }\nol{ list-style:decimal; }\nli,li p{ margin:10px 0;}\nimg{ max-width:100%;display:block;margin:0 auto 1em; }\nblockquote{ color:#B5B2B1; border-left:3px solid #aaa; padding:1em; }\nstrong,b{font-weight:bold;}\nem,i{font-style:italic;}\ntable{ width:100%;border-collapse:collapse;border-spacing:1px;margin:1em 0;font-size:.9em; }\nth,td{ padding:5px;text-align:left;border:1px solid #aaa; }\nth{ font-weight:bold;background:#5d5d5d; }\n.symbol-link{font-weight:bold;}\n/* header{ border-bottom:1px solid #494756; } */\n.title{ margin:0 0 8px;line-height:1.3;color:#ddd; }\n.meta {color:#5e5c6d;font-size:13px;margin:0 0 .5em; }\na{text-decoration:none; color:#2a4b87;}\n.meta .head { display: inline-block; overflow: hidden}\n.head .h-thumb { width: 30px; height: 30px; margin: 0; padding: 0; border-radius: 50%; float: left;}\n.head .h-content { margin: 0; padding: 0 0 0 9px; float: left;}\n.head .h-name {font-size: 13px; color: #eee; margin: 0;}\n.head .h-time {font-size: 11px; color: #7E829C; margin: 0;line-height: 11px;}\n.small {font-size: 12.5px; display: inline-block; transform: scale(0.9); -webkit-transform: scale(0.9); transform-origin: left; -webkit-transform-origin: left;}\n.smaller {font-size: 12.5px; display: inline-block; transform: scale(0.8); -webkit-transform: scale(0.8); transform-origin: left; -webkit-transform-origin: left;}\n.bt-text {font-size: 12px;margin: 1.5em 0 0 0}\n.bt-text p {margin: 0}\n</style>\n</head>\n<body>\n<div class=\"wrapper\">\n<header>\n<h2 class=\"title\">\nWorst Is Likely Over for ASMPT -- Market Talk\n</h2>\n\n<h4 class=\"meta\">\n\n\n<div class=\"head\" \">\n\n\n<div class=\"h-thumb\" style=\"background-image:url(https://static.tigerbbs.com/150f88aa4d182df19190059f4a365e99);background-size:cover;\"></div>\n\n<div class=\"h-content\">\n<p class=\"h-name\">Dow Jones </p>\n<p class=\"h-time\">2025-07-24 12:51</p>\n</div>\n\n</div>\n\n\n</h4>\n\n</header>\n<article>\n<font class=\"NormalMinus1\" face=\"Arial\">\n<p>\n     0451 GMT - The worst is likely over for <a href=\"https://laohu8.com/S/00522\">ASMPT</a>, Citi analysts say in a research note. The semiconductor company has delivered a large thermocompression-bonding tool order to a leading memory chip maker, they say, while another client has begun using ASMPT's bonding tool for low-volume production of 12-layer HBM4 chips. Order volume could become more meaningful in 2026 and 2027 as next-generation AI chips ramp up, they say. Mainstream semiconductor outlook is also improving, driven by AI data centers and EV demand in China, the analysts say. Citi says that new orders for ASMPT's thermocompression-bonding tool could be positive catalysts for its share price. Citi maintains a buy call on ASMPT and raises its target price to HK$75.00 from HK$65.00. Shares are last at HK$69.00. (sherry.qin@wsj.com) \n</p>\n<pre>\n \n</pre>\n<p>\n  (END) Dow Jones Newswires\n</p>\n<p>\n  July 24, 2025 00:51 ET (04:51 GMT)\n</p>\n<p>\n  Copyright (c) 2025 Dow Jones &amp; Company, Inc.\n</p>\n</font>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"LU0417516571.SGD","symbol_name":"Allianz Oriental Income Cl AT Acc SGD","start_time":0,"source_url":"https://dowjonesnews.com/newdjn/logon.aspx?AL=N","article_id":"2553273445","we_media_id":"106","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2553273445","pubTimestamp":1753332660,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Dow Jones","introduction":"Dow Jones publishes the world’s most trusted business news and financial information in a variety of media.","home_visible":0,"id":"106","head_image":"https://static.tigerbbs.com/150f88aa4d182df19190059f4a365e99"},"summary":"0451 GMT - The worst is likely over for ASMPT, Citi analysts say in a research note. The semiconductor company has delivered a large thermocompression-bonding tool order to a leading memory chip maker, they say, while another client has begun using ASMPT's bonding tool for low-volume production of 12-layer HBM4 chips. Order volume could become more meaningful in 2026 and 2027 as next-generation AI chips ramp up, they say. Mainstream semiconductor outlook is also improving, driven by AI data centers and EV demand in China, the analysts say. Citi says that new orders for ASMPT's thermocompression-bonding tool could be positive catalysts for its share price. Citi maintains a buy call on ASMPT and raises its target price to HK$75.00 from HK$65.00. Shares are last at HK$69.00. 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The semiconductor company has delivered a large thermocompression-bonding tool order to a leading memory chip maker, they say, while another client has begun using ASMPT's bonding tool for low-volume production of 12-layer HBM4 chips. Order volume could become more meaningful in 2026 and 2027 as next-generation AI chips ramp up, they say. Mainstream semiconductor outlook is also improving, driven by AI data centers and EV demand in China, the analysts say. Citi says that new orders for ASMPT's thermocompression-bonding tool could be positive catalysts for its share price. Citi maintains a buy call on ASMPT and raises its target price to HK$75.00 from HK$65.00. Shares are last at HK$69.00. (sherry.qin@wsj.com) \n\n\n \n\n\n  (END) Dow Jones Newswires\n\n\n  July 24, 2025 00:51 ET (04:51 GMT)\n\n\n  Copyright (c) 2025 Dow Jones & Company, Inc.","kind":"highlight","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":true,"code":"91000000","status":"200"}}}