【大跌】德州仪器:模拟芯片需求弱于预期,股价大跌11.4%;欧盟将与日本联手开采稀土;三星将从16层HBM引入混合键合技术

爱集微
24 Jul

1.三星电子将从16层HBM开始逐步引入混合键合技术2.甲骨文将为OpenAI数据中心提供200万颗AI芯片3.德州仪器Q3盈利预警:模拟芯片需求弱于预期,股价大跌11.4%4.芯片设备制造商ASM第二季度订单下降4%,不及预期5.欧盟将与日本联手开采稀土,监督半导体等供应链6.软银与OpenAI发生分歧,5000亿美元“星际之门”项目大幅缩水?1.三星电子将从16层HBM开始逐步引入混合键合技术...

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