7月23日,三星电子的半导体业务正面临双重压力:在先进工艺代工和高带宽内存(HBM)供应方面,均未能获得英伟达等主要客户的大量订单。然而,据韩国当地媒体报道,这一局面本有可能在七年前通过不同的战略决策得以避免。知情人士透露,英伟达首席执行官黄仁勋曾在2018年秘密到访三星电子,提出在三个关键领域展开深度合作:联合开发先进HBM内存、推进8纳米之后的先进制程代工技术,以及共同推动CUDA软件生态的...
Source Link7月23日,三星电子的半导体业务正面临双重压力:在先进工艺代工和高带宽内存(HBM)供应方面,均未能获得英伟达等主要客户的大量订单。然而,据韩国当地媒体报道,这一局面本有可能在七年前通过不同的战略决策得以避免。知情人士透露,英伟达首席执行官黄仁勋曾在2018年秘密到访三星电子,提出在三个关键领域展开深度合作:联合开发先进HBM内存、推进8纳米之后的先进制程代工技术,以及共同推动CUDA软件生态的...
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