本周A股半导体公司继续披露2025年上半年业绩报告,晶合集成、长川科技、德邦科技、扬杰科技、聚灿光电、格科微、灿勤科技H1业绩预告/报告显示,这7家公司上半年业绩均实现同比增长,不过亚翔集成由于海外新签约项目尚未有效转化为业绩,导致H1出现业绩下滑情况。A股本周另一重要事件是,多家上市公司接棒向港交所递表IPO申请,东山精密、中微半导、立讯精密、金力永磁、胜宏科技等产业链公司已开启赴港上市征程,...
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