中银国际发表研究报告指，ASMPT第二季盈利逊于预期，但综合B/B值保持在1.11，有助支撑公司第三季的收入指引。先进封装业务在今年上半年贡献39%收入，考虑到对热压键合及其他先进封装工具的结构性人工智能需求等因素，先进封装业务势头或会持续。该行将ASMPT 2025至27年的盈测分别下调15%、4%及3%，以反映更高的营运开支预测，但由于SMT和主流半导体业务明显复苏，维持“买入”评级，目标价由81港元微降至80港元。
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