据日媒，台积电在日本熊本县菊阳町兴建的第二座晶圆厂，投产时间将从原订的2027年底延后至2029年上半年。台积电今年稍早曾以当地交通问题为由，预告延后动工，最新规划显示，工程将延迟至2025年下半年启动。目前熊本一厂已于2024年底量产，主要生产12至28纳米制程的车用逻辑芯片与影像传感器。报道指，日本是台积电海外布局的一环，公司此前承诺在美国投资逾千亿美元扩产。此次的延迟反映地缘政治与基础建设挑战，正影响全球半导体供应链重组步调。
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