台积电在美先进封装布局启动

爱集微
28 Jul

台积电在美国启动先进封装(AP)建厂规画浮上台面,首座先进封装预计明年动工。据悉,已有承包业者开始招募CoWoS设备服务工程师,将派驻美国亚利桑那州。供应链透露,台积电美国先进封装会以SoIC(系统整合单芯片)、CoW(Chip on Wafer)为主,后段oS(on Substrate)预计将委由Amkor进行。在AI需求强劲带动下,台积电加大对美投资,总金额高达1,650亿美元,规划兴建6座...

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