Bank of Tianjin Co. Ltd. Completes RMB3.0 Billion 2025 Sci-tech Innovation Bonds Issuance

Reuters

Jul 30, 2025

Bank of Tianjin Co. Ltd. Completes RMB3.0 Billion 2025 Sci-tech Innovation Bonds Issuance

Bank of Tianjin Co., Ltd. has announced the issuance of its "2025 Sci-tech Innovation Bonds" in the National Inter-bank Bond Market. The issuance was completed on July 30, 2025, following the book building process that took place on July 28, 2025. These are five-year fixed rate bonds with a total issue size of RMB3.0 billion and a coupon rate of 1.80%. Interest on the bonds has been accruing since July 30, 2025. The proceeds from these bonds will be directed towards supporting the sci-tech innovation sector, in line with the Overall Statistical System for the "Five Priority Areas" of Finance. The bonds aim to extend sci-tech loans and invest in bonds issued by enterprises in the sci-tech innovation field.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Bank of Tianjin Co. Ltd. published the original content used to generate this news brief on July 30, 2025, and is solely responsible for the information contained therein.

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

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Completes RMB3.0 Billion 2025 Sci-tech Innovation Bonds Issuance","media":"Reuters","content":"<html xmlns=\"http://www.w3.org/1999/xhtml\" xmlns:newsg2=\"http://iptc.org/std/nar/2006-10-01/\" xmlns:xhtml=\"http://www.w3.org/1999/xhtml\"><head><title>\n      Bank of Tianjin Co. Ltd. Completes RMB3.0 Billion 2025 Sci-tech Innovation Bonds Issuance\n    </title></head><body><div xmlns:xsd=\"http://www.w3.org/2001/XMLSchema\" xmlns:xsi=\"http://www.w3.org/2001/XMLSchema-instance\">\n<p>\n        Bank of Tianjin Co., Ltd. has announced the issuance of its \"2025 Sci-tech Innovation Bonds\" in the National Inter-bank Bond Market. The issuance was completed on July 30, 2025, following the book building process that took place on July 28, 2025. These are five-year fixed rate bonds with a total issue size of RMB3.0 billion and a coupon rate of 1.80%. Interest on the bonds has been accruing since July 30, 2025. 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Ltd. published the original content used to generate this news brief on July 30, 2025, and is solely responsible for the information contained therein.</span></em>\n</div></body></html>\n\n</article>\n</div>\n</body>\n</html>\n","isBrief":false,"type":0,"news_type":1,"symbol":"01578","symbol_name":"天津银行","start_time":0,"source_url":"https://api.refinitiv.com/data/news/v1/stories/urn:newsml:reuters.com:20250730:nNDL7q3v0L:1","article_id":"2555012116","we_media_id":"1032215980","thumbnails":[],"rights":null,"url":"https://stock-news.laohu8.com/highlight/detail?id=2555012116","pubTimestamp":1753869537,"columns":[],"sourceInfo":null,"weMediaInfo":{"media_name":"Reuters","introduction":"Reuters.com brings you the latest news from around the world, covering breaking news in markets, business, politics, entertainment and technology","home_visible":1,"id":"1032215980","head_image":"https://community-static.tradeup.com/news/4567337cbdf294b657b1fa87c5488b48"},"summary":"Bank of Tianjin Co., Ltd. has announced the issuance of its \"2025 Sci-tech Innovation Bonds\" in the National Inter-bank Bond Market. The issuance was completed on July 30, 2025, following the book building process that took place on July 28, 2025. These are five-year fixed rate bonds with a total issue size of RMB3.0 billion and a coupon rate of 1.80%. Interest on the bonds has been accruing since July 30, 2025. The proceeds from these bonds will be directed towards supporting the sci-tech innovation sector, in line with the Overall Statistical System for the \"Five Priority Areas\" of Finance. The bonds aim to extend sci-tech loans and invest in bonds issued by enterprises in the sci-tech innovation field.Disclaimer: This news brief was created by Public Technologies  using generative artificial intelligence. 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