人工智能的军备竞赛,正从芯片设计延伸至后端封装,一场围绕台积电CoWoS产能的争夺战已然打响。 台积电先进封装技术(CoWoS)已成为各大巨头争夺的AI战略要地。据追风交易台消息,摩根士丹利最新发布的研究报告,对2026年台积电及其合作伙伴的CoWoS产能分配进行了详细预测。数据显示,芯片巨头英伟达预计将锁定2026年全球CoWoS总需求的六成,进一步巩固其市场霸主地位。 报告预测,全球对...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.