金吾财讯 | 华安证券研报指,ASMPT(00522)业务现已涵盖半导体封装(SEMI)设备和表面贴装技术(SMT)设备两大核心领域。其中,在半导体封装业务板块,公司产品主要用于传统集成电路/分立器件封装(例如引线键合设备、倒装键合设备)、先进封装(例如热压键合设备、混合键合设备、物理气相沉积/电化学沉积设备、激光切割/开槽设备),以及用于CMOS图像传感器/LED/光子学的综合性封装解决方案;在...
Source Link金吾财讯 | 华安证券研报指,ASMPT(00522)业务现已涵盖半导体封装(SEMI)设备和表面贴装技术(SMT)设备两大核心领域。其中,在半导体封装业务板块,公司产品主要用于传统集成电路/分立器件封装(例如引线键合设备、倒装键合设备)、先进封装(例如热压键合设备、混合键合设备、物理气相沉积/电化学沉积设备、激光切割/开槽设备),以及用于CMOS图像传感器/LED/光子学的综合性封装解决方案;在...
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