来源:内容编译自wccftech。据报道,NVIDIA 一直在考虑将 CoWoP 作为其下一个封装解决方案,并可能被其下一代 Rubin GPU 采用。CoWoS(晶圆上芯片基板封装)是现代高性能计算 (HPC) 和人工智能 (AI) 芯片的首选封装解决方案。这项技术于近 14 年前首次亮相,目前已被 NVIDIA 和 AMD 的 AI 巨头采用。CoWoS 的另一个关键优势在于它是一项成熟的封装...
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