消息称三星计划在美国建芯片封装厂 投资金额达70亿美元

观点网
Jul 30

观点网讯:7月30日,据市场消息,三星计划在美国建立一家先进芯片封装工厂,投资金额高达70亿美元。据悉,这也是三星继泰勒晶圆厂之后在美半导体领域的又一重大落子。过往报道,7月28日,据三星电子向监管机构提交文件,该公司与一家全球大公司签署价值165亿美元的芯片制造供应协议,合同自2025年7月24日起生效,以巩固其在全球半导体市场的竞争地位。该协议价值22.8万亿韩元(165亿美元),合同期持续至...

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