晶圆代工大厂,入账165亿美元!

全球半导体观察
Jul 29, 2025

据外媒报道,三星电子于7月28日宣布已与一家客户达成价值22.8万亿韩元(约165亿美元)的长期芯片代工协议。报道指出,三星电子在送交的相关文件中宣布,已签署价值165亿美元的芯片代工合约。值得一提的是,此份合同所涉及的金额相当于三星2024年营收的7.6%。三星表示,合约于7月24日生效,有效期至2033年12月31日。尽管三星并未透露客户名称及其他具体细节,但业内人士猜测,该客户很可能是美国...

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