摩根士丹利(大摩)最新研究报告预测,2026年全球CoWoS晶圆总需求将达100万片,其中,英伟达抢下60%产能。摩根士丹利对2026年台积电及其合作伙伴的CoWoS产能分配进行了详细预测,英伟达仍居主导地位,预计2026年CoWoS晶圆需求量将高达59.5万片,占全球市场约60%,其中约51万片将由台积代工,主要用于英伟达下一代Rubin架构AI芯片。据此推算,2026年英伟达芯片出货量可达...
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