金融界2025年8月4日消息,国家知识产权局信息显示,超威半导体公司申请一项名为“全动态封装后修复”的专利,公开号CN120418765A,申请日期为2023年12月。专利摘要显示,一种存储器控制器包括命令队列、仲裁器和控制器。该控制器响应于修复信号,用于将数据从存储器的故障区域迁移到缓冲器,生成至少一个命令以执行该故障区域的封装后修复操作,以及将该数据从该缓冲器迁移到该存储器的替代区域。该控制器...
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