先进封装,高速发展

半导体行业观察
Aug 04

来源:内容编译自Yole。先进封装在不同市场中的多样化需求和产量,推动其市场规模从380亿美元增长至2030年的790亿美元。这一增长由各种需求和挑战驱动,但仍保持持续上升的趋势。这种多功能性使先进封装能够保持持续创新和适应,满足不同市场在产量、技术要求和平均售价方面的特定需求。然而,当某些市场面临低迷或波动时,这种灵活性也会给先进封装行业带来风险。2024年,先进封装受益于数据中心市场的快速增长...

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