决战混合键合

半导体行业观察
Aug 04

在存储领域,键合方式一直是几家厂商关心的核心问题。随着先进封装技术的发展,尤其是3D NAND和高带宽存储器(HBM)不断迈向更高堆叠层数与更紧密互连,对键合技术的精度、密度与良率提出了前所未有的挑战。在这一背景下,“混合键合”(Hybrid Bonding)正迅速从实验室技术走向大规模量产,成为存储芯片制造的新支柱。传统的热压键合或微凸点互连(micro-bump)方案,虽然已经在一定程度上满足...

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