英伟达探索的CoWoP封装技术是什么?

半导体芯闻
Aug 07, 2025

如果您希望可以时常见面,欢迎标星 收藏哦~来源:内容来自巨亨网。摩根大通称,英伟达正在探索的芯片封装技术CoWoP,将利用先进的高密度PCB(印刷电路板)技术,去除CoWoS封装中的ABF基板层,直接将中介层与PCB连接,具有简化系统结构,更好的热管理性能和更低功耗等优势。该技术有望替代现有的CoWoS封装方案。最近市场炒得火热的芯片晶圆板封装(CoWoP)技术,与现有的CoWoS封装有什么区别?...

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