三星电子公司周四表示将在美国德克萨斯州奥斯汀的芯片代工厂生产苹果公司的下一代芯片。苹果方面表示正与三星在奥斯汀的工厂合作开发一种创新的新芯片制造技术。这是该技术首次在美国引入该工厂将提供优化苹果产品(包括销往全球的iPhone)的能效和性能的芯片。业内观察人士认为这款芯片很可能是一款用于下一代iPhone的CMOS图像传感器(CIS)。三星拒绝证实细节。
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