来源:内容来自nextplatform随着云计算、高性能计算(HPC)以及如今的人工智能(AI)推动企业计算不断发展,再加上半导体设计与制造相关的技术挑战和成本持续增加,对Chiplet(小芯片)架构的需求也在不断上升。过去几年,英特尔、AMD等系统级芯片(SoC)制造商一直在不断增强其Chiplet能力,将更小、可复用的小芯片以模块化架构组合在一起,以提升效率、灵活性和定制化能力。不过,这些基于...
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