为与英特尔、台积电争夺超大规模芯片系统集成订单三星电子正研发基于415mm×510mm尺寸长方形面板的SoP(System on Panel面板上系统)封装这是一项无需PCB基板和硅中介层、采用RDL重布线层实现通信的先进封装技术。 (ZDNET Korea)。
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