聚焦:人工智能、芯片等行业欢迎各位客官关注、转发每日芯报0815期芯德半导体再次完成近4亿元融资,系国内先进封测研发商近日,江苏芯德半导体科技股份有限公司再次完成近4亿元融资,前段时间刚完成最新一轮总额近4亿元的融资,将进一步巩固其在移动产品及异质性封装模组领域的技术优势。本轮融资由南京市、区两级机构联合领投,江苏南京先进制造产业专项母基金、元禾璞华和雨山资本跟投。融资资金将主要用于进一步加速布局...
Source Link聚焦:人工智能、芯片等行业欢迎各位客官关注、转发每日芯报0815期芯德半导体再次完成近4亿元融资,系国内先进封测研发商近日,江苏芯德半导体科技股份有限公司再次完成近4亿元融资,前段时间刚完成最新一轮总额近4亿元的融资,将进一步巩固其在移动产品及异质性封装模组领域的技术优势。本轮融资由南京市、区两级机构联合领投,江苏南京先进制造产业专项母基金、元禾璞华和雨山资本跟投。融资资金将主要用于进一步加速布局...
Source LinkDisclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.