帝尔激光:上半年在TOPCon等激光技术上均有全新技术覆盖及订单实现

格隆汇
Aug 13

帝尔激光(300776)8月12日在电话会议中表示,上半年,公司在TOPCon、XBC等激光技术上,均有全新激光技术覆盖及订单实现,应用于背接触电池(BC)的全新激光微蚀刻设备,继续取得新的量产订单;在TOPCon电池上,激光选择性减薄(TCP)设备已获得量产订单,激光隔离钝化(TCI)设备量产导入推进顺利。组件方面,公司正在研发的激光新焊接工艺,可以简化生产工艺,减少电池片的损伤,提高焊接质量、提升组件效率。TGV激光微孔设备,公司已经完成面板级玻璃基板通孔设备的出货,实现了晶圆级和面板级TGV封装激光技术的全面覆盖。

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