智通财经APP获悉，建滔积层板(01888)午前涨超7%，截至发稿，涨6.58%，报12港元，成交额1.48亿港元。
中金发布研报称，当前全球算力需求呈系统性扩张，GPU及ASIC正经历显著放量，同时叠加高频高速等材料(M9、石英布等)的应用与高阶高多层的设计有望显著提升单板价值量，驱动PCB行业量价齐升。对海外算力芯片(GPU+ASIC)及网络通讯设备(交换机+光模块)需求进行梳理，测算得2025、2026年AI相关PCB市场规模总量有望达56/100亿美元。
该行续指，受益于AI对算力基建的强劲需求，PCB板及CCL市场持续高景气，产业链核心供应商加速扩产。中金对A股7家上市公司扩产公告进行梳理，其公告合计投资约320亿元用于PCB产能扩建，产品逐步向高端化升级，但由于高阶产品良率爬坡周期较长，且东南亚供应链本土化配套尚不成熟，产能释放效率可能滞后于需求增速，供需缺口在中期内仍将持续存在。
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