8月12日跟踪苹果产业链多年的天风国际证券分析师郭明𫓹发布研报指出长兴击败日商Namics与Nagase(长濑)首度成为

智通财经
Aug 13
8月12日跟踪苹果产业链多年的天风国际证券分析师郭明𫓹发布研报指出长兴击败日商Namics与Nagase(长濑)首度成为台积电先进封装材料供应商预计在2026年量产。长兴为苹果2026年新款iPhone与Mac处理器的先进封装材料之独家供应商(分别供应MUF与LMC)最快在2027-2028年成为台积电CoWoS LMC独家或主要供应商。

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