如果您希望可以时常见面,欢迎标星 收藏哦~来源:内容来自经济日报。晶圆代工龙头台积电=持续深化先进封装技术,正式推出全新平台“CoPoS(Chip-on-Panel-on-Substrate)”,整合CoWoS与FOPLP优势,采用方形面板设计,有效解决大尺寸AI芯片的翘曲与成本问题,成为下一代高效封装关键。CoPoS核心在于将芯片排列于大型方形面板RDL层,取代传统圆形硅中介层,导入玻璃或蓝宝石...
Source Link如果您希望可以时常见面,欢迎标星 收藏哦~来源:内容来自经济日报。晶圆代工龙头台积电=持续深化先进封装技术,正式推出全新平台“CoPoS(Chip-on-Panel-on-Substrate)”,整合CoWoS与FOPLP优势,采用方形面板设计,有效解决大尺寸AI芯片的翘曲与成本问题,成为下一代高效封装关键。CoPoS核心在于将芯片排列于大型方形面板RDL层,取代传统圆形硅中介层,导入玻璃或蓝宝石...
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