传英伟达入局HBM 台积电仍是合作伙伴中大赢家

爱集微
Aug 16

英伟达传出将跨入HBM base die(堆栈最底层的裸晶)市场,引发业界关注。相关厂商认为,目前该市场竞争激烈,过往掌握在DRAM大厂手中,但随着制程难度提升,ASIC厂商如创意正在锁定相关潜在领域。法人认为,对CSP大厂而言,采用英伟达解决方案机率不高,但NVLink Fusion合作伙伴有望受惠,其中包括联发科、世芯等厂商,将受惠其模组化设计,获得更多商机。IC设计厂商透露,HBM4以上...

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