2月25日,据韩媒报道,SK海力士宣布在韩国京畿道龙仁 半导体 集群内正式动工建造一期晶圆厂。该项目投资约9.4万亿韩元(475.64亿元人民币),主要用于生产下一代DRAM存储器,包括高带宽存储器(HBM),以满足AI市场下,日益增长的存储器芯片需求。图源:包图网当前,全球半导体行业正在经历前所未有的高需求期,尤其是在AI、 物联网 和 汽车电子 等多个新兴领域的推动下,对高性能芯片的需求...
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