来源:内容来自工商时报。市场传出,英伟达(NVIDIA)已启动自家HBM(高频宽存储器)Base Die的设计计划,未来无论搭配那一家存储器品牌的HBM堆栈产品,底层逻辑裸片(Base Die)都将采用英伟达自有设计方案,制程节点锁定3nm,预估将于2027年下半年开始小量试产。此消息一出,震撼HBM生态链,市场人士担忧,恐改写下一代HBM市场竞争版图。目前HBM市占率最高为SK海力士,其HBM ...
Source Link来源:内容来自工商时报。市场传出,英伟达(NVIDIA)已启动自家HBM(高频宽存储器)Base Die的设计计划,未来无论搭配那一家存储器品牌的HBM堆栈产品,底层逻辑裸片(Base Die)都将采用英伟达自有设计方案,制程节点锁定3nm,预估将于2027年下半年开始小量试产。此消息一出,震撼HBM生态链,市场人士担忧,恐改写下一代HBM市场竞争版图。目前HBM市占率最高为SK海力士,其HBM ...
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