英伟达 CEO 黄仁勋 8 月 22 日突然到访中国台湾地区,并在受访时透露此行主要目的是拜访台积电,感谢其在下一代芯片架构 Rubin 上的协助。黄仁勋指出,下一代 Rubin 架构已有六款全新芯片在台积电完成投片,涵盖新 CPU、GPU、NVLink 交换器、网络芯片、网络交换器以及硅光子处理器。他表示,台积电的营运团队为此付出了大量努力,自己此行专程前来表达感谢。针对外界关注的 H20 芯片...
Source Link英伟达 CEO 黄仁勋 8 月 22 日突然到访中国台湾地区,并在受访时透露此行主要目的是拜访台积电,感谢其在下一代芯片架构 Rubin 上的协助。黄仁勋指出,下一代 Rubin 架构已有六款全新芯片在台积电完成投片,涵盖新 CPU、GPU、NVLink 交换器、网络芯片、网络交换器以及硅光子处理器。他表示,台积电的营运团队为此付出了大量努力,自己此行专程前来表达感谢。针对外界关注的 H20 芯片...
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