集成电路等领域六大项目落地上海临港,总投资超400亿元

全球半导体观察
Aug 21, 2025

近日,总投资额超400亿元的6个重磅项目集中签约落地上海临港,涵盖集成电路、高端装备、汽车软件、人工智能等关键方向。项目分别为盛合晶微三维芯片集成项目、水下机器人项目、鲁汶仪器集成电路设备研发生产基地等。重磅签约:三大“硬核”项目引领产业升级01盛合晶微三维芯片集成项目盛合晶微(SJSemi)是国内先进封装领域的代表企业之一。三维芯片集成项目聚焦于后摩尔时代最核心的三维芯片集成技术和Chiplet...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10