先进封装新战局,CoWoP能否挑战CoWoS霸主地位?

中电网
Aug 21, 2025

过去几年,台积电的CoWoS技术因满足AI芯片对算力及能效的需求,迅速成为先进封装的代名词。然而,近期由英伟达工程师提出的“CoWoP”技术却突然被推上风口浪尖,甚至有人预言它将改写PCB产业版图,挑战CoWoS的领先地位。 CoWoP究竟是短暂的话题炒作,还是足以改变半导体封装版图的下一个颠覆力量?CoWoP是什么?为何比CoWoS更具优势?台积电CoWoS(Chip-on-Wafer-on-...

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