(信息来源:biz.chosun)三星电机正加快向快速成长的人工智能(AI)定制芯片(ASIC)市场供应倒装芯片(FC)-球栅阵列(BGA)的步伐。据悉,三星电机已从向亚马逊供应AI半导体“Trainium”用FC-BGA开始,计划从明年起正式向苹果、谷歌和Meta供应FC-BGA。在其负责基板业务的封装解决方案事业部盈利恶化的背景下,公司正收紧对高附加值基板供应的控制。根据三星电机22日发布的...
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