【产业信息速递】三星封装,重大突破

北京半导体行业...
Aug 25

(信息来源:biz.chosun)三星电机正加快向快速成长的人工智能(AI)定制芯片(ASIC)市场供应倒装芯片(FC)-球栅阵列(BGA)的步伐。据悉,三星电机已从向亚马逊供应AI半导体“Trainium”用FC-BGA开始,计划从明年起正式向苹果、谷歌和Meta供应FC-BGA。在其负责基板业务的封装解决方案事业部盈利恶化的背景下,公司正收紧对高附加值基板供应的控制。根据三星电机22日发布的...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10