近日,多家碳化硅企业发布半年度报道,并披露了碳化硅业务最新进展,具体如下:士兰微:基于Ⅱ代SiC-MOSFET芯片的主驱模块累计出货2万颗,预计8吋产线年末通线;扬杰科技:SiC MOS市场份额持续增加,芯片&模块产线均实现投产;赛晶科技:自研1200V/13mΩSiC芯片,收购湖南虹安实现SiC业务互补;新洁能:SiC MOSFET实现批量供货,预计年末推出车规级产品。士兰微:预计8吋SiC产线...
Source Link近日,多家碳化硅企业发布半年度报道,并披露了碳化硅业务最新进展,具体如下:士兰微:基于Ⅱ代SiC-MOSFET芯片的主驱模块累计出货2万颗,预计8吋产线年末通线;扬杰科技:SiC MOS市场份额持续增加,芯片&模块产线均实现投产;赛晶科技:自研1200V/13mΩSiC芯片,收购湖南虹安实现SiC业务互补;新洁能:SiC MOSFET实现批量供货,预计年末推出车规级产品。士兰微:预计8吋SiC产线...
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