最新消息显示,台积电在美国规划的两座先进封装厂(AP1、AP2)已进入整地工程阶段,并预计在2026年下半年开始盖厂,目标在2028年完工投产。根据规划,两座先进封装厂将锁定不同技术,其中,AP1将聚焦当前最前沿的3D堆叠技术(SoIC&CoW),AP2则侧重CoPoS技术,以此满足对AI和高性能计算芯片的封装需求。另有外媒报道称,台积电已经开始招募CoWoS设备服务工程师,将负责生产CoWoS...
Source Link最新消息显示,台积电在美国规划的两座先进封装厂(AP1、AP2)已进入整地工程阶段,并预计在2026年下半年开始盖厂,目标在2028年完工投产。根据规划,两座先进封装厂将锁定不同技术,其中,AP1将聚焦当前最前沿的3D堆叠技术(SoIC&CoW),AP2则侧重CoPoS技术,以此满足对AI和高性能计算芯片的封装需求。另有外媒报道称,台积电已经开始招募CoWoS设备服务工程师,将负责生产CoWoS...
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