IT之家 8 月 30 日消息,科技媒体 Tom's Hardware 昨日(8 月 29 日)发布博文,报道称 AMD 资深研究员、SoC 首席架构师 Laks Pappu 在其 LinkedIn 资料中透露,AMD 正研发新一代基于 2.5D / 3.5D 芯粒(chiplet)封装及单芯片(monolithic)架构的 GPU,意味着该公司有望在下一代产品中重返高性能 GPU 竞争。IT之家...
Source LinkIT之家 8 月 30 日消息,科技媒体 Tom's Hardware 昨日(8 月 29 日)发布博文,报道称 AMD 资深研究员、SoC 首席架构师 Laks Pappu 在其 LinkedIn 资料中透露,AMD 正研发新一代基于 2.5D / 3.5D 芯粒(chiplet)封装及单芯片(monolithic)架构的 GPU,意味着该公司有望在下一代产品中重返高性能 GPU 竞争。IT之家...
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