高盛:台厂封装测试产业前景乐观,AI概念股具上攻动能

爱集微
Aug 31, 2025

高盛最新路演报告指出,先进封装设备厂商如弘塑(3131)与万润(6187)受到投资人关注,认为委外封装测试厂产能贡献可能被低估。预计到2027年底,CoWoS总产能将达到约20万片晶圆。在测试产业方面,旺硅(6223)与颖威同样受到青睐。高盛分析,随着芯片设计日趋复杂,先进测试需求持续增加,对两家公司而言是不可挡的结构性成长趋势。预测到2027年,旺硅与颖威在探针卡、插座市场的全球市占率将分别提升...

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