炒股就看金麒麟分析师研报,权威,专业,及时,全面,助您挖掘潜力主题机会!(来源:超能网)AMD和英伟达都将在2026年的下一代AI加速器中首次采用定制HBM,均为基于HBM4的设计,以提升性能,降低延迟。前一段时间有传言称,英伟达已开始开发自己的HBM基础裸片(Base Die),以适应未来的发展趋势,这很可能重塑HBM的格局。预计英伟达的自研HBM基础裸片采用台积电(TSMC)的3nm工艺制造,...
Source Link炒股就看金麒麟分析师研报,权威,专业,及时,全面,助您挖掘潜力主题机会!(来源:超能网)AMD和英伟达都将在2026年的下一代AI加速器中首次采用定制HBM,均为基于HBM4的设计,以提升性能,降低延迟。前一段时间有传言称,英伟达已开始开发自己的HBM基础裸片(Base Die),以适应未来的发展趋势,这很可能重塑HBM的格局。预计英伟达的自研HBM基础裸片采用台积电(TSMC)的3nm工艺制造,...
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