快科技9月3日消息,AMD下一代Zen 6架构的锐龙处理器将将分别采用台积电2nm和3nm工艺制造CCD和IOD。根据Kepler_L2最新透露,AMD下一代锐龙CPU将采用台积电N2P“2nm”工艺技术用于CCD(计算芯片),而IOD(输入/输出芯片)将采用台积电的N3P“3nm”工艺技术。目前Zen 5架构的锐龙CPU的CCD采用4nm工艺,IOD则采用6nm工艺。在Zen 6架构中,IOD将...
Source Link快科技9月3日消息,AMD下一代Zen 6架构的锐龙处理器将将分别采用台积电2nm和3nm工艺制造CCD和IOD。根据Kepler_L2最新透露,AMD下一代锐龙CPU将采用台积电N2P“2nm”工艺技术用于CCD(计算芯片),而IOD(输入/输出芯片)将采用台积电的N3P“3nm”工艺技术。目前Zen 5架构的锐龙CPU的CCD采用4nm工艺,IOD则采用6nm工艺。在Zen 6架构中,IOD将...
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