AMD CDNA 4 架构与 MI350技术解析|Hot Chips 2025

Ofweek光电信息网
Sep 01, 2025

芝能智芯出品在 2025 年 Hot Chips 大会上,AMD 对外详细阐述了其最新的 CDNA 4 架构以及基于该架构的 MI350 系列加速器。与前代 MI300 相比,MI350 在工艺、封装、内存层次结构和互连带宽上进行了全面升级,目标直指快速膨胀的大模型训练与推理市场。其核心亮点包括 1850 亿晶体管的堆叠式设计、3nm N3P 工艺计算芯片、双 NUMA 域灵活分区、FP4/FP6...

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