测试设备需求持续增加!

天天IC
Sep 01

集微网·爱集微APP,各大主流应用商店均可下载高盛报告指出,台系先进封装设备厂商如弘塑与万润受到投资人关注,认为委外封装测试厂产能贡献可能被低估,预计到2027年底,CoWoS总产能将达到约20万片晶圆。在测试产业方面,旺硅与颖威同样受到青睐。高盛分析,随着芯片设计日趋复杂,先进测试需求持续增加,对两家公司而言是不可挡的结构性成长趋势。预测到2027年,旺硅与颖威在探针卡、插座市场的全球市占率将...

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